Function Block Factory: An open solution for IO-Link Function Blocks
01 July, 2020The Function Block Factory (FBF) from SICK, an open software-based service, automatically creates function blocks for IO-Link implementation.
Neousys ETHY-100 expansion I/O module
24 April, 2020The Neousys ETHY-100 is a system expansion I/O module featuring eight digital I/O, dual Ethernet ports and a status monitor/indicator.
OPC UA companion specification to be developed for CIP
21 April, 2020ODVA has launched a joint working group with the OPC Foundation to develop an OPC UA companion specification to the Common Industrial Protocol (CIP).
Four generations of I/O integration
28 January, 2020 by Shishir Rege*Over the years, technology has improved in the routing and terminating of I/O, increasing efficiency and productivity for machine builders.
igus develops smart plastics app for Fanuc FIELD system
10 January, 2020Fanuc has announced an open industrial IoT platform for which third-party vendors can create apps.
Pepperl+Fuchs SC-System signal conditioners
06 December, 2019The user-friendly and slim design makes the SC-System signal conditioners a practical and economical solution, offering a high packing density due to their low heat dissipation.
Wireless fieldbus solves robot problem for NZ manufacturer
04 December, 2019Communication failures caused by cable faults in a stacker robot were solved with a wireless fieldbus system.
ODVA announces EtherNet/IP enhancements
04 December, 2019ODVA has published enhancements to the EtherNet/IP Specification for IO-Link integration and NE107 diagnostics.
Softing Profibus Tester 5
01 August, 2019The Softing Profibus Tester 5 is an all-in-one tool for testing bus physics, bus communication and cabling.
PROFINET with TSN Specification completed
19 July, 2019Profibus International has announced that Profinet specification 2.4 has been completed.
FDT Group approves FITS specification for final member review
27 June, 2019The FDT IIoT Server standard will empower platform-independent, information-driven business models.
Satisfying manufacturers through simpler integration
21 June, 2019The Open Integration program aims to acheive fast and manufacturer-independent integration of components and devices into various automation systems.
ICP DAS ECAT-M801 EtherCAT PCIe module
14 June, 2019The ECAT-M801 EtherCAT PCIe module provides motion control up to 32 axes, and connectivity with up to 64 slave nodes.
Pepperl+Fuchs G10 ultra-compact AS-I module
01 May, 2019The G10 ultra-compact AS-Interface module is an AS-I slave module with a size of 22 x 27 x 40 mm per I/O.
Pilz PSS u2 ES 4IOL IO-Link master module
24 April, 2019The PSS u2 ES 4IOL IO-Link master module is designed to enable communication between the PSSuniversal 2 remote I/O system and sensors or actuators.