Siemens Simatic ET 200SP distributed I/O system

The Simatic ET 200SP distributed I/O system has been expanded with additional communication modules for the AS-Interface and IO-Link, as well as a version for extreme conditions.

The CM AS-i Master communication module is used for connecting actuators and sensors compliant with the AS-Interface profile to Simatic ET 200SP. For safety-oriented applications, the F-CM AS-i Safety version can be used.

The IO-Link master module enables actuators and sensors compliant with the current IO-Link specification V1.1 to be connected to Simatic ET 200SP. One feature of the ET 200SP is that the master parameters are automatically backed up. This means that a module can be swapped from the master or devices without the need for a programming device or having to restore the data in the user program. The IO-Link master module continues to support IO-Link devices according to specification V1.0.

For use in hostile industrial conditions, such as high temperatures, high humidity or corrosive gas atmospheres, the Simatic ET 200SP distributed IO system has now been expanded to include Siplus ET 200SP. This version avoids derating, for example, at extreme temperatures.