Balluff distributed modular I/O system

Balluff’s new generation of distributed modular I/O can be used in a cost-effective way to replace standard slice I/O and distributed I/O solutions. Offering IP67 protection and industry-standard connectors, many types of control data can be collected. Using standard 3-conductor cables, up to four slave devices can be connected to each master block, which communicates over the industrial ethernet network to the controller.

In lieu of a backplane, each I/O device is connected to an industry-standard M12 port, creating an IP67 connection. With the ability to be installed within a 20 m radius from the master device, slave devices can be easily distributed across the machine. Utilising a widely accepted and open point-to-point technology, IO-Link, a distributed modular I/O system is fieldbus independent, easily configured and vendor neutral.

Types of distributed modular I/O slave devices that are available include discrete I/O, analog I/O, valve manifold control, industrial RFID processors and heads, and specialty sensors for measurement, position or colour detection.

Industrial ethernet master blocks are available with EtherNet/IP or Profinet protocols. EtherNet/IP masters support daisy-chain connections with a built-in switch as well as support the Device Level Ring (DLR) topology for easier troubleshooting. Profinet blocks support Fast Start Up (FSU) as well as the Link Layer Discovery Protocol (LLDP) for easy set-up right out of the box. Both master devices have easy-to-use, lockable push-button displays for quick set-up and provide webpages for configuration or diagnostics purposes.