FieldComm Group announces unified device integration roadmap

FieldComm Group has announced the official timeline for releasing the updated Field Device Integration (FDI) Specification. The organisation says this milestone marks a critical step toward unifying device integration across process, hybrid and factory automation.

Following the transfer of FDT/DTM assets to FieldComm Group in 2024, the organisation has significantly accelerated its efforts toward unified device integration. The resulting roadmap is a product of coordinated work by the FieldComm Group’s Strategic Integration Committee (SIC) and specialised working groups. Comprising board-level companies from FieldComm Group along with key leaders from OPC Foundation, ODVA, and PROFIBUS & PROFINET International (PI), the SIC has led the harmonisation of FDI and FDT technologies. This collaboration aims to deliver a unified, intuitive and scalable device integration standard that addresses the evolving needs of modern manufacturing, helping both end users and vendors.

Key enhancements in the updated FDI Specification include:

• compliance, incorporating the requirements of the Cyber Resilience Act (CRA);
• a unified device integration standard for process and factory automation;
• support for legacy systems, enabling modernisation without infrastructure replacement;
• real-time OT/IT connectivity through a common information model (PA-DIM);
• support for modern platforms and development tools; and
• empowering intelligent device and life cycle management with protocol tunneling support, also known as nested communications.
   

Release of the updated FDI Specification is slated for the end of 2026, and deployment of the updated FDI Developer Toolkit for the end of 2027. Market availability of registered FDI-enabled systems and devices is expected in 2029.

“Today’s industrial systems are more complex than ever, yet this complexity must not compromise interoperability,” said Steve Biegacki, Chair of the Strategic Integration Committee. “Our goal is to deliver a unified device integration solution that enhances data interoperability with OT/IT systems while supporting innovative features for modern manufacturing. This approach also provides a practical migration path, safeguarding existing investments and preparing the industry for future advancements.”

“As a co-owner of the FDI specification, the OPC Foundation is committed to robust and interoperable device integration for OPC UA users and fully supports the harmonisation of FDI and FDT technologies to achieve this goal,” added Stefan Hoppe, President of the OPC Foundation.

“ODVA is pleased to support the harmonisation of FDI and FDT technologies to enable enhanced device integration interoperability for users of EtherNet/IP,” stated Al Beydoun, President and Executive Director of ODVA.

“PI appreciates that the FieldComm Group initiated the valuable discussions to determine the need for merging FDI and FDT, taking into account the needs of interested companies, as well as the technologies of the four participating standards development associations,” concluded Dietmar Bohn, Executive Director of PI.

This update will enable manufacturers to transition toward more intelligent, responsive operations, unlocking the full value of industrial data and modern automation architectures.

FieldComm Group encourages automation stakeholders, vendors, integrators and end users alike to engage in this transition and follow key milestones.

Those interested can subscribe for updates at www.fieldcommgroup.org/subscribe.

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