Teledyne FLIR Boson+ thermal camera modules

Teledyne FLIR has announced the expansion of the Boson+ thermal camera module product line with 24 compact models featuring 320 x 256 resolution. Radiometry — the ability to take the temperature of every pixel — as well as both MIPI and CMOS interfaces is now also available on all resolutions. With these updates and a thermal sensitivity of 20 mK or less, the product is suitable for integration in unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), automotive, wearables, security applications, handhelds and thermal sights.

Boson+ is a drop-in upgrade for systems designed with Boson, making upgrades low risk and plug-and-play. With user-selectable USB, CMOS or MIPI video interfaces, it is easy to integrate Boson+ with a wide range of embedded processors.

The product range features 640 x 512 and now 320 x 256 resolutions utilising a 12 µm pixel pitch thermal detector within a size, weight and power (SWaP) optimised package. The noise equivalent differential temperature (NEDT) of 20 mK or less offers enhanced detection, recognition and identification (DRI) performance, especially in low-contrast and low-visibility environments. With improved automatic gain control (AGC) and video latency compared to previous iterations of Boson, the product is said to offer enhanced scene contrast and sharpness while improving tracking, seeker performance and decision support.