Hendon Semiconductors wins federal grant to support defence manufacturing

Thursday, 09 November, 2023

Hendon Semiconductors wins federal grant to support defence manufacturing

Hendon Semiconductors, a division of Legend Corporation, has announced it has obtained a $690,000 grant as part of the federal government’s Sovereign Industrial Capability Priority Grant scheme.

The funding is paired with matching investments from Hendon and will enable the company to launch its Defence Manufacturing Capability Modernisation Project.

Originally established as Philips Semiconductors in 1959, Hendon Semiconductors is a long-established electronic solutions provider based just outside of Adelaide. It has a long track record as an integrated circuit design and test facility as well as a designer and manufacturer of both thick film hybrids and electronic printed circuit board-based controls across a range of industries including defence, medical and rail.

Hendon Semiconductors plans to undertake a Defence Manufacturing Capability Modernisation Project to upgrade its facilities by acquiring advanced manufacturing equipment to enhance its hybrid integrated circuit (HIC) and printed circuit board assembly (PCBA) production capabilities as well as its sustainment services for the defence sector. The new equipment will enable it to significantly improve the lead time and build quality of both prototypes and small manufacturing runs of electronics to the defence industry and in doing so strengthen defence innovation in Australia.

“I’m thrilled at the opportunity to fast-track Hendon’s modernisation, particularly in relation to our ability to quickly develop quality prototypes without the reliance on overseas partners, strengthening and significantly accelerating innovation in defence and other industries in Australia — something we’re very passionate about,” said Brenton Judge, Executive General Manager for Hendon Semiconductors.

A total investment of $1.6 million — including the matched funds from Hendon Semiconductors — will allow the company to procure and install state-of-the-art equipment including PCB prototyping equipment, flying probe test systems, a conformal coating machine, an X-ray machine and soldering robots.

The upgraded facility will be completed in October 2024, though most equipment will be online in early March.

With the support of this grant, Hendon Semiconductors’ modernised facility will enhance its hybrid integrated circuit (HIC) and printed circuit board assembly (PCBA) production capabilities.

Image: Hendon Semiconductors.

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